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Edge Impulse and Conservation X Labs are teaming up to bring an AI-enabled camera for ecology and wildlife monitoring applications. https://twitter.com/conservationx/status/1575166560922374144?s=20&t=Nk5lOX69MhcpALGRcMMyHg Conservation X Labs currently offers a solution called "Sentinel" for AI-on-the-edge using field-deployed cameras and microphones.  https://sentinel.conservationxlabs.com/  

From THEELEC news:  https://www.thelec.net/news/articleView.html?idxno=4249 South Korean fabless chip firm Pixelplus will show of engineering samples of its automotive CMOS image sensor to customers during the first quarter. The new product, called PK5130KA, will begin mass production during the second half of 2023 and contribute to the company’s revenue in 2024, Pixelplus said. It will the company’s first chip that will be supplied directly to tier-1 suppliers of automobile firms. Pixelplus had previously supplied such chips through automotive solution firms at a lower price. Supplying directly to tier-1 suppliers __ called before-market in the industry __ is more difficult due to the harder requirements that they must meet. Tier-1 suppliers require such chips to meet AEC-Q100 and ISO26262 standards, the global reliability and safety standards. ISO has ratings from A to D with D being the highest standard. Image sensors require the B grade. PK5120KA meets these standards, accordin...

In a recent preprint ( https://arxiv.org/ftp/arxiv/papers/2209/2209.14242.pdf ) Ponizovskaya-Devine et al. describe a new Ge-on-Si image sensor with enhanced sensitivity up to 1.7um for NIR applications. Abstract We present a Germanium “Ge-on-Si” CMOS image sensor with backside illumination for the near-infrared (NIR) electromagnetic waves (wavelength range 300–1700 nm) detection essential for optical sensor technology. The micro-holes help to enhance the optical efficiency and extend the range to the 1.7 µm wavelength. We demonstrate an optimization for the width and depth of the nano-holes for maximal absorption in the near infrared. We show a reduction in the cross-talk by employing thin SiO2 deep trench isolation in between the pixels. Finally, we show a 26–50% reduction in the device capacitance with the introduction of a hole. Such CMOS-compatible Ge-onSi sensors will enable high-density, ultra-fast and efficient NIR imaging.

In a recent preprint ( https://arxiv.org/pdf/2209.11772.pdf ) Gyongy et al. describe a new 64x32 SPAD-based direct time-of-flight sensor with in-pixel histogramming and processing capability. Abstract 3D flash LIDAR is an alternative to the traditional scanning LIDAR systems, promising precise depth imaging in a compact form factor, and free of moving parts, for applications such as self-driving cars, robotics and augmented reality (AR). Typically implemented using single-photon, direct time-of-flight (dToF) receivers in image sensor format, the operation of the devices can be hindered by the large number of photon events needing to be processed and compressed in outdoor scenarios, limiting frame rates and scalability to larger arrays. We here present a 64 × 32 pixel (256 × 128 SPAD) dToF imager that overcomes these limitations by using pixels with embedded histogramming, which lock onto and track the return signal. This reduces the size of output data frames considerably, enabling max...

https://www.techinsights.com/webinar/hybrid-bonding-technology Hybrid bonding technology is rapidly becoming a standard approach in chipmaking due to its ability to increase connection densities. This webinar will: Examine different hybrid bonding approaches implemented in recent devices Discuss key players currently using this technology Look to the future of hybrid bonding, discussing potential wins – and pitfalls – to come. This presentation compiles content from TechInsights’ subject matter experts in Memory, Image Sensor, and Logic, and from Engineers specializing in a variety of reverse engineering techniques. Many of these experts will be on hand for the live Q&A session following the presentation.   A preview of the topics that will be discussed: Advanced Logic First saw Chip on Wafer (CoW) hybrid bonding technology in the AMD Ryzen 7. Stacking memory directly with the processor greatly increases available cache memory. Milestone for system-technology-co-optimization (h...

From:  https://r2.community.samsung.com/t5/Galaxy-S/Samsung-announces-200MP-ISCOCELL-HPX-sensor/td-p/12437363 Samsung has announced the ISCOCELL HPX, a new 200MP sensor in China. This follows the June announcement of the ISOCELL HP3 200MP sensor. The ISOCELL HPX has 0.56-micron pixel size, which can reduce the camera module area by 20%, making the smartphone body thinner and smaller. Furthermore, Samsung employed Advanced DTI (Deep Trench Isolation) technology, which not only separates each pixel individually, but also increases sensitivity to capture crisp and vivid images. Furthermore, the Super QPD autofocus solution enables ISOCELL HPX to have ultra-fast and ultra-precise autofocus. Tetra-Pixel technology in ISOCELL HPX sensor Additionally, the Tetra pixel (16 pixels in one) technology is used in this new sensor that will give positive shooting experience in low light. With the help of this technology, the ISOCELL HPX is able to automatically switch between three different ligh...

Videos from the recent machine vision trade fair VISION Stuttgart are now available online. Day 1:  https://www.messe-stuttgart.de/vision/en/on-demand/industrial-vision-days-day-1 Opening, Camera Technology, Robot Vision, Software & Deep Learning, Optics and Ilumination Day 2:  https://www.messe-stuttgart.de/vision/en/on-demand/industrial-vision-days-day-2 3D, Hyperspectral imaging, Vision Processing, Camera Technology, Software & Deep Learning, Standards Day 3:  https://www.messe-stuttgart.de/vision/en/on-demand/industrial-vision-days-day-3 Hyperspectral imaging, Camera Technology, Software and Deep Learning, Vision Processing, Optics and Illumination Full program list is available here:  https://www.messe-stuttgart.de/vision/fileadmin/media/besucher/Industrial_VISION_Days/industrial-vision-days-2022-program-overview.pdf.pdf