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From Electronics Weekly and Yole: https://www.electronicsweekly.com/news/business/inp-moving-into-consumer-2022-10/ https://www.yolegroup.com/strategy-insights/apple-and-the-compound-semi-industry-the-story-begins/   The InP device market is expanding from traditional datacom and telecom towards the consumer reaching about $5.6 billion by 2027, says Yole Developpement.   Datacom and telecom applications are the traditional markets for InP.Land will continue to grow, but the biggest growth driver – with a 37% CAGR between 2021 and 2027 – will be consumer. The InP supply chain is fragmented, though it is dominated by two vertically integrated American players: Coherent (formerly II-VI) and Lumentum. The InP supply chain will need more investment with the rise of the consumer applications. The migration to higher data rates, lower power consumption within data centres, and the deployment of 5G base stations will drive the development and growth of optical transceiver technology in the com

Sequoia's CellCap3D is a software tool specifically designed for the capacitance matrix calculation of image sensor cells. It is fast, accurate and easy to use. Please contact SEQUOIA Design Systems, Inc. for further details at info@sequoiadesignsystems.com

Graphene Flagship ( https://graphene-flagship.eu/ ) spearhead project AUTOVISION is developing a new high-resolution image sensor for autonomous vehicles, which can detect obstacles and road curvature even in extreme and difficult driving conditions.     SPAD and CIS camera fusion for high resolution high dynamic range passive imaging (IEEE/CVF WACV 2022) Authors: Yuhao Liu (University of Wisconsin-Madison)*; Felipe Gutierrez-Barragan (University of Wisconsin-Madison); Atul N Ingle (University of Wisconsin-Madison); Mohit Gupta ("University of Wisconsin-Madison, USA "); Andreas Velten (University of Wisconsin - Madison) Description: Reconstruction of high-resolution extreme dynamic range images from a small number of low dynamic range (LDR) images is crucial for many computer vision applications. Current high dynamic range (HDR) cameras based on CMOS image sensor technology rely on multiexposure bracketing which suffers from motion artifacts and signal-to-noise (SNR) dip a

The final call for papers for 2023 IISW is now available: https://imagesensors.org/2023-international-image-sensor-workshop/ To submit an abstract , please go to: https://c mt3.research.microsoft.com/IISW2023 The deadline for abstract submission is 11:59pm, Friday December 9th , 20 22 ( GMT ). The 20 23 International Image Sensor Workshop (IISW ) provides a biennial opportunity to present innovative work in the area of solid - state image sensors and share new results with the image sensor community. Now in its 3 5th year, the workshop will return to an in - person format. T he event is intended for image sensor technologists; in order to encourage attendee interaction and a shared experience, attendance is limited, with strong acceptance preference given to workshop presenters . As is the tradition, the 20 23 workshop will emphasize an open exchange of information among participants in an informal , secluded setting beside the Scottish town

A new paper in Nature titled "An integrated imaging sensor for aberration-corrected 3D photography" by Wu et al. from Tsinghua University presents a new meta-optics based aberration correcting image sensor. They also show several applications such as optical flow and depth imaging in addition to atmospheric aberration correction. The full paper is open access: https://www.nature.com/articles/s41586-022-05306-8 Abstract: Planar digital image sensors facilitate broad applications in a wide range of areas and the number of pixels has scaled up rapidly in recent years. However, the practical performance of imaging systems is fundamentally limited by spatially nonuniform optical aberrations originating from imperfect lenses or environmental disturbances. Here we propose an integrated scanning light-field imaging sensor, termed a meta-imaging sensor, to achieve high-speed aberration-corrected three-dimensional photography for universal applications without additional hardware modif

https://www.yolegroup.com/product/report/x-ray-imaging/   Market dynamics in digital X-ray imaging have been impacted by the Covid crisis, the current geopolitical context and new environmental policies. The Covid crisis upset demand in medical systems in 2020 and 2021. Healthcare facilities prioritized their budgets to fight Covid, boosting static radiography and computed tomography (CT). Many surgeries, mammographies or dental diagnoses have been delayed, slowing demand in these segments by about a year. The medical business eventually returned to its pre-Covid dynamic and is expected to grow from $1,780M in 2021 to $2,128M in 2027 at the detector level. The security business suffered in 2020 and 2021, with airport shutdowns and borders closing. But now the recovery of air transportation and the tense geopolitical context with the Ukraine-Russia war is driving demand in this segment. Security is expected to go from $50M in 2021 to $57M in 2027. Industry also suffered from a global ec

In recent news on consolidation in the LiDAR market, Ouster and Velodyne have announced a merger deal. Ouster makes "digital" LiDAR sensors based on single photon avalanche diode technology whereas Velodyne is known for their more "traditional" avalanche photodiode based spinning LiDARs. https://investors.ouster.com/news/news-details/2022/Ouster-and-Velodyne-Announce-Proposed-Merger-of-Equals-to-Accelerate-Lidar-Adoption/default.aspx SAN FRANCISCO--(BUSINESS WIRE)-- Ouster (NYSE: OUST), a leading provider of high-resolution digital lidar, and Velodyne (NASDAQ: VLDR, VLDRW), a leading global player in lidar sensors and solutions, announced that they have entered into a definitive agreement to merge in an all-stock transaction. The proposed merger is expected to drive significant value creation and result in a strong financial position through robust product offerings, increased operational efficiencies, ​​and a complementary customer base in fast-growing end-markets

Edge Impulse and Conservation X Labs are teaming up to bring an AI-enabled camera for ecology and wildlife monitoring applications. https://twitter.com/conservationx/status/1575166560922374144?s=20&t=Nk5lOX69MhcpALGRcMMyHg Conservation X Labs currently offers a solution called "Sentinel" for AI-on-the-edge using field-deployed cameras and microphones.  https://sentinel.conservationxlabs.com/  

From THEELEC news:  https://www.thelec.net/news/articleView.html?idxno=4249 South Korean fabless chip firm Pixelplus will show of engineering samples of its automotive CMOS image sensor to customers during the first quarter. The new product, called PK5130KA, will begin mass production during the second half of 2023 and contribute to the company’s revenue in 2024, Pixelplus said. It will the company’s first chip that will be supplied directly to tier-1 suppliers of automobile firms. Pixelplus had previously supplied such chips through automotive solution firms at a lower price. Supplying directly to tier-1 suppliers __ called before-market in the industry __ is more difficult due to the harder requirements that they must meet. Tier-1 suppliers require such chips to meet AEC-Q100 and ISO26262 standards, the global reliability and safety standards. ISO has ratings from A to D with D being the highest standard. Image sensors require the B grade. PK5120KA meets these standards, according to

In a recent preprint ( https://arxiv.org/ftp/arxiv/papers/2209/2209.14242.pdf ) Ponizovskaya-Devine et al. describe a new Ge-on-Si image sensor with enhanced sensitivity up to 1.7um for NIR applications. Abstract We present a Germanium “Ge-on-Si” CMOS image sensor with backside illumination for the near-infrared (NIR) electromagnetic waves (wavelength range 300–1700 nm) detection essential for optical sensor technology. The micro-holes help to enhance the optical efficiency and extend the range to the 1.7 µm wavelength. We demonstrate an optimization for the width and depth of the nano-holes for maximal absorption in the near infrared. We show a reduction in the cross-talk by employing thin SiO2 deep trench isolation in between the pixels. Finally, we show a 26–50% reduction in the device capacitance with the introduction of a hole. Such CMOS-compatible Ge-onSi sensors will enable high-density, ultra-fast and efficient NIR imaging.