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From Electronics Weekly and Yole: https://www.electronicsweekly.com/news/business/inp-moving-into-consumer-2022-10/ https://www.yolegroup.com/strategy-insights/apple-and-the-compound-semi-industry-the-story-begins/   The InP device market is expanding from traditional datacom and telecom towards the consumer reaching about $5.6 billion by 2027, says Yole Developpement.   Datacom and telecom applications are the traditional markets for InP.Land will continue to grow, but the biggest growth driver – with a 37% CAGR between 2021 and 2027 – will be consumer. The InP supply chain is fragmented, though it is dominated by two vertically integrated American players: Coherent (formerly II-VI) and Lumentum. The InP supply chain will need more investment with the rise of the consumer applications. The migration to higher data rates, lower power consumption within data centres, and the deployment of 5G base stations will drive the development and growth of optical transceiver technology i...

Sequoia's CellCap3D is a software tool specifically designed for the capacitance matrix calculation of image sensor cells. It is fast, accurate and easy to use. Please contact SEQUOIA Design Systems, Inc. for further details at info@sequoiadesignsystems.com

Graphene Flagship ( https://graphene-flagship.eu/ ) spearhead project AUTOVISION is developing a new high-resolution image sensor for autonomous vehicles, which can detect obstacles and road curvature even in extreme and difficult driving conditions.     SPAD and CIS camera fusion for high resolution high dynamic range passive imaging (IEEE/CVF WACV 2022) Authors: Yuhao Liu (University of Wisconsin-Madison)*; Felipe Gutierrez-Barragan (University of Wisconsin-Madison); Atul N Ingle (University of Wisconsin-Madison); Mohit Gupta ("University of Wisconsin-Madison, USA "); Andreas Velten (University of Wisconsin - Madison) Description: Reconstruction of high-resolution extreme dynamic range images from a small number of low dynamic range (LDR) images is crucial for many computer vision applications. Current high dynamic range (HDR) cameras based on CMOS image sensor technology rely on multiexposure bracketing which suffers from motion artifacts and signal-to-noise (SNR) dip a...

The final call for papers for 2023 IISW is now available: https://imagesensors.org/2023-international-image-sensor-workshop/ To submit an abstract , please go to: https://c mt3.research.microsoft.com/IISW2023 The deadline for abstract submission is 11:59pm, Friday December 9th , 20 22 ( GMT ). The 20 23 International Image Sensor Workshop (IISW ) provides a biennial opportunity to present innovative work in the area of solid - state image sensors and share new results with the image sensor community. Now in its 3 5th year, the workshop will return to an in - person format. T he event is intended for image sensor technologists; in order to encourage attendee interaction and a shared experience, attendance is limited, with strong acceptance preference given to workshop presenters . As is the tradition, the 20 23 workshop will emphasize an open exchange of information among participants in an informal , secluded setting beside the Scottish town...

A new paper in Nature titled "An integrated imaging sensor for aberration-corrected 3D photography" by Wu et al. from Tsinghua University presents a new meta-optics based aberration correcting image sensor. They also show several applications such as optical flow and depth imaging in addition to atmospheric aberration correction. The full paper is open access: https://www.nature.com/articles/s41586-022-05306-8 Abstract: Planar digital image sensors facilitate broad applications in a wide range of areas and the number of pixels has scaled up rapidly in recent years. However, the practical performance of imaging systems is fundamentally limited by spatially nonuniform optical aberrations originating from imperfect lenses or environmental disturbances. Here we propose an integrated scanning light-field imaging sensor, termed a meta-imaging sensor, to achieve high-speed aberration-corrected three-dimensional photography for universal applications without additional hardware modif...

https://www.yolegroup.com/product/report/x-ray-imaging/   Market dynamics in digital X-ray imaging have been impacted by the Covid crisis, the current geopolitical context and new environmental policies. The Covid crisis upset demand in medical systems in 2020 and 2021. Healthcare facilities prioritized their budgets to fight Covid, boosting static radiography and computed tomography (CT). Many surgeries, mammographies or dental diagnoses have been delayed, slowing demand in these segments by about a year. The medical business eventually returned to its pre-Covid dynamic and is expected to grow from $1,780M in 2021 to $2,128M in 2027 at the detector level. The security business suffered in 2020 and 2021, with airport shutdowns and borders closing. But now the recovery of air transportation and the tense geopolitical context with the Ukraine-Russia war is driving demand in this segment. Security is expected to go from $50M in 2021 to $57M in 2027. Industry also suffered from a globa...

In recent news on consolidation in the LiDAR market, Ouster and Velodyne have announced a merger deal. Ouster makes "digital" LiDAR sensors based on single photon avalanche diode technology whereas Velodyne is known for their more "traditional" avalanche photodiode based spinning LiDARs. https://investors.ouster.com/news/news-details/2022/Ouster-and-Velodyne-Announce-Proposed-Merger-of-Equals-to-Accelerate-Lidar-Adoption/default.aspx SAN FRANCISCO--(BUSINESS WIRE)-- Ouster (NYSE: OUST), a leading provider of high-resolution digital lidar, and Velodyne (NASDAQ: VLDR, VLDRW), a leading global player in lidar sensors and solutions, announced that they have entered into a definitive agreement to merge in an all-stock transaction. The proposed merger is expected to drive significant value creation and result in a strong financial position through robust product offerings, increased operational efficiencies, ​​and a complementary customer base in fast-growing end-markets...

Edge Impulse and Conservation X Labs are teaming up to bring an AI-enabled camera for ecology and wildlife monitoring applications. https://twitter.com/conservationx/status/1575166560922374144?s=20&t=Nk5lOX69MhcpALGRcMMyHg Conservation X Labs currently offers a solution called "Sentinel" for AI-on-the-edge using field-deployed cameras and microphones.  https://sentinel.conservationxlabs.com/  

From THEELEC news:  https://www.thelec.net/news/articleView.html?idxno=4249 South Korean fabless chip firm Pixelplus will show of engineering samples of its automotive CMOS image sensor to customers during the first quarter. The new product, called PK5130KA, will begin mass production during the second half of 2023 and contribute to the company’s revenue in 2024, Pixelplus said. It will the company’s first chip that will be supplied directly to tier-1 suppliers of automobile firms. Pixelplus had previously supplied such chips through automotive solution firms at a lower price. Supplying directly to tier-1 suppliers __ called before-market in the industry __ is more difficult due to the harder requirements that they must meet. Tier-1 suppliers require such chips to meet AEC-Q100 and ISO26262 standards, the global reliability and safety standards. ISO has ratings from A to D with D being the highest standard. Image sensors require the B grade. PK5120KA meets these standards, accordin...

In a recent preprint ( https://arxiv.org/ftp/arxiv/papers/2209/2209.14242.pdf ) Ponizovskaya-Devine et al. describe a new Ge-on-Si image sensor with enhanced sensitivity up to 1.7um for NIR applications. Abstract We present a Germanium “Ge-on-Si” CMOS image sensor with backside illumination for the near-infrared (NIR) electromagnetic waves (wavelength range 300–1700 nm) detection essential for optical sensor technology. The micro-holes help to enhance the optical efficiency and extend the range to the 1.7 µm wavelength. We demonstrate an optimization for the width and depth of the nano-holes for maximal absorption in the near infrared. We show a reduction in the cross-talk by employing thin SiO2 deep trench isolation in between the pixels. Finally, we show a 26–50% reduction in the device capacitance with the introduction of a hole. Such CMOS-compatible Ge-onSi sensors will enable high-density, ultra-fast and efficient NIR imaging.

In a recent preprint ( https://arxiv.org/pdf/2209.11772.pdf ) Gyongy et al. describe a new 64x32 SPAD-based direct time-of-flight sensor with in-pixel histogramming and processing capability. Abstract 3D flash LIDAR is an alternative to the traditional scanning LIDAR systems, promising precise depth imaging in a compact form factor, and free of moving parts, for applications such as self-driving cars, robotics and augmented reality (AR). Typically implemented using single-photon, direct time-of-flight (dToF) receivers in image sensor format, the operation of the devices can be hindered by the large number of photon events needing to be processed and compressed in outdoor scenarios, limiting frame rates and scalability to larger arrays. We here present a 64 × 32 pixel (256 × 128 SPAD) dToF imager that overcomes these limitations by using pixels with embedded histogramming, which lock onto and track the return signal. This reduces the size of output data frames considerably, enabling max...

https://www.techinsights.com/webinar/hybrid-bonding-technology Hybrid bonding technology is rapidly becoming a standard approach in chipmaking due to its ability to increase connection densities. This webinar will: Examine different hybrid bonding approaches implemented in recent devices Discuss key players currently using this technology Look to the future of hybrid bonding, discussing potential wins – and pitfalls – to come. This presentation compiles content from TechInsights’ subject matter experts in Memory, Image Sensor, and Logic, and from Engineers specializing in a variety of reverse engineering techniques. Many of these experts will be on hand for the live Q&A session following the presentation.   A preview of the topics that will be discussed: Advanced Logic First saw Chip on Wafer (CoW) hybrid bonding technology in the AMD Ryzen 7. Stacking memory directly with the processor greatly increases available cache memory. Milestone for system-technology-co-optimization (h...

From:  https://r2.community.samsung.com/t5/Galaxy-S/Samsung-announces-200MP-ISCOCELL-HPX-sensor/td-p/12437363 Samsung has announced the ISCOCELL HPX, a new 200MP sensor in China. This follows the June announcement of the ISOCELL HP3 200MP sensor. The ISOCELL HPX has 0.56-micron pixel size, which can reduce the camera module area by 20%, making the smartphone body thinner and smaller. Furthermore, Samsung employed Advanced DTI (Deep Trench Isolation) technology, which not only separates each pixel individually, but also increases sensitivity to capture crisp and vivid images. Furthermore, the Super QPD autofocus solution enables ISOCELL HPX to have ultra-fast and ultra-precise autofocus. Tetra-Pixel technology in ISOCELL HPX sensor Additionally, the Tetra pixel (16 pixels in one) technology is used in this new sensor that will give positive shooting experience in low light. With the help of this technology, the ISOCELL HPX is able to automatically switch between three different ligh...

Videos from the recent machine vision trade fair VISION Stuttgart are now available online. Day 1:  https://www.messe-stuttgart.de/vision/en/on-demand/industrial-vision-days-day-1 Opening, Camera Technology, Robot Vision, Software & Deep Learning, Optics and Ilumination Day 2:  https://www.messe-stuttgart.de/vision/en/on-demand/industrial-vision-days-day-2 3D, Hyperspectral imaging, Vision Processing, Camera Technology, Software & Deep Learning, Standards Day 3:  https://www.messe-stuttgart.de/vision/en/on-demand/industrial-vision-days-day-3 Hyperspectral imaging, Camera Technology, Software and Deep Learning, Vision Processing, Optics and Illumination Full program list is available here:  https://www.messe-stuttgart.de/vision/fileadmin/media/besucher/Industrial_VISION_Days/industrial-vision-days-2022-program-overview.pdf.pdf

Source:  https://announcements.atomos.com/4207684 Atomos completes development of world class 8K video sensor and is exploring commercialisation [Oct 5, 2022] Highlights: Atomos announces that it has completed development of a world class 8K video sensor to allow video cameras to record in 8K ultra high resolution 8K Ultra HD televisions are already in the market from Samsung, Sony and LG but 8K content has been lagging  The Company is exploring opportunities to commercialise its unique IP and is in discussion with several camera makers Atomos Limited (‘ASX:AMS’, ‘Atomos’ or the ‘Company’) is pleased to announce that it has completed development of  a  world  class  8K  video  sensor    which  allows  cameras  to  record  in  8K  ultra  high  definition.  Atomos acquired the intellectual property rights   and technical team from broadcast equipment firm, Grass Valley five years ...

  https://www.icinsights.com/news/bulletins/CMOS-Image-Sensors-Stall-In-Perfect-Storm-Of-2022/ CMOS Image Sensors Stall in ‘Perfect Storm’ of 2022 For most of the last two decades strong growth in CMOS image sensors pushed this product category to the top of the optoelectronics market, in terms of sales volume, generating over 40% of total opto-semiconductor annual revenues. In 2022, however, the CMOS image sensor market category is on track to suffer its first decline in 13 years with sales expected to fall 7% to $18.6 billion and unit shipments projected to drop 11% to 6.1 billion worldwide, according to IC Insights’ August 3Q Update of The McClean Report service (Figure 1). The projected 2022 decline in CMOS image sensors comes after two years of meager sales growth in 2020 (+4%) and 2021 (+5%).  This year’s sales drop reflects overall weakness in consumer smartphones and portable computers with digital cameras for video conferencing following an upsurge in demand for Inter...

Teledyne e2v's Topaz series of industrial CMOS sensors include 2MP (1920 x 1080) and 1.5MP (1920 x 800) resolution devices. The sensors use state-of-the-art low noise, global-shutter pixel technology to offer powerful solutions and enable compact designs for many applications. Optimom™ 2M is the first in a range of MIPI CSI-2 optical modules. Powered by Teledyne e2v’s proprietary image sensor technology, Optimom has been thoughtfully designed to ensure there is minimum development effort required for vision-based embedded systems for robotics, logistics, drones, or laboratory equipment. Find out more https://imaging.teledyne-e2v.com/optimom Time-of-Flight (ToF) sensors from ams enable highly accurate distance measurement and 3D mapping and imaging. Time-of-Flight (ToF) sensors from ams OSRAM are based on proprietary SPAD (Single Photon Avalanche Photodiode) pixel design and time-to-digital converters (TDCs) which have an extremely narrow pulse width. They measure in real time the d...

Registration and other information:  https://atpi.eventsair.com/workshop-on-cmos-image-sensors/registration-page/Site/Register CNES, ESA, AIRBUS DEFENCE & SPACE, THALES ALENIA SPACE, SODERN are pleased to invite you to submit an abstract to the 7th “Space & Scientific CMOS Image Sensors” workshop to be held in ESA-ESTEC on November 22 nd and 23rd 2022 within the framework of the Optics and Optoelectronics COMET (Communities of Experts). The aim of this workshop is to focus on CMOS image sensors for scientific and space applications. Although this workshop is organized by actors of the Space Community, it is widely open to other professional imaging applications such as Machine vision, Medical, Advanced Driver Assistance Systems (ADAS), and Broadcast (UHDTV) that boost the development of new pixel and sensor architectures for high end applications. Furthermore, we would like to invite Laboratories and Research Centres which develop Custom CMOS image sensors with advanced sma...

From Geospatial World: https://www.geospatialworld.net/news/calumino-10-3mn-funding-ai-thermal-sensing-platform/ Calumino, the developer and manufacturer of a proprietary next-generation thermal sensor technology and AI, today announced its $10.3M USD Series A funding. The funding round is led by Celesta Capital and Taronga Ventures, with additional participation from Egis Technology and others. Calumino’s innovation offers the first-ever intelligent sensing platform, which is an aggregator of new and valuable data points on human presence, activity, hazards, and the environment. As the world’s first thermal sensor to combine A.I. with high performance image sensing, privacy protection, and affordability, Calumino’s platform enables new benefits for a broad range of applications. This includes smart building management, pest control, safety and security, healthcare, and more. The Calumino thermal sensor has been natively designed with a sufficiently low resolution to protect an individ...

Prophesee closes €50M C Series round with new investment from Prosperity7 to drive commercialization of revolutionary neuromorphic vision technology; Becomes EU’s most well-funded fabless semiconductor startup Link:  https://www.prophesee.ai/2022/09/22/prophesee-closes-50million-fundraising-round/ PARIS, September 22, 2022 – Prophesee, the inventor of the world’s most advanced neuromorphic vision systems, today announced the completion of its Series C round of funding with the addition of a new investment from Prosperity7 ventures. The round now totals €50m, including backing from initial Series C investors Sinovation Ventures and Xiaomi. They join an already strong group of international investors from North America, Europe and Japan that includes Intel Capital, Robert Bosch Venture Capital, 360 Capital, iBionext, and the European Investment Bank. With the investment round, Prophesee becomes EU’s most well-funded fabless semiconductor startup, having raised a total of €127M since...